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DuPont's Electronics Business, Qnity, Signs MOU With SK Hynix, Establishing Strategic Long-Term Agreement For Supply Of Polishing Pads For CMP In Semiconductor Fabrication

Benzinga · 10/16 13:10

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Strategic Collaboration to Support Advanced Semiconductor Manufacturing with High-Performance Materials

WILMINGTON, Del., Oct. 16, 2025 /PRNewswire/ -- Qnity, DuPont's Electronics business, a premier technology solutions leader across the semiconductor value chain, today announced the signing of a Memorandum of Understanding (MOU) with SK hynix, establishing a strategic long-term agreement for the supply of polishing pads for chemical mechanical planarization (CMP) in semiconductor fabrication.

The agreement supports SK hynix's ongoing needs for advanced CMP pads, used for their next-generation semiconductor manufacturing and mass production processes. It reflects the continuation of a longstanding collaboration in enabling CMP materials for SK hynix's growing memory business.

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